620-M3-Quiz4

620-M3-Quiz4

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Question 1 of 10

1. Question
What is the maximum allowable limit percentage of nickel (Ni) for an assembly that uses tin lead (SnPb) solder baths?
- 0.01
- 0.1
- 0.5
- 0.05
Correct

Incorrect
Question 2 of 10

2. Question
What is the condition for a Class 1 assembly that after soldering has evidence of no-clean flux residue on an electrical mating surface?
- Acceptable
- Process Indicator
- Defect
- Not Established
Correct

Incorrect
Question 3 of 10

3. Question
What is the condition for a Class 3 assembly when the solder used for tinning is different than what is used in subsequent soldering processes?
- Acceptable
- Process Indicator
- Defect
- Not Established
Correct

Incorrect
Question 4 of 10

4. Question
True or False: It is acceptable to reflow the solder connection when performing shrink sleeving operations.
- True
- False
Correct

Incorrect
Question 5 of 10

5. Question
What is the condition for a Class 2 assembly when the wire wrap has 165 degrees contact between the wire and turret terminal post?
- Acceptable
- Process Indicator
- Defect
- Not Established
Correct

Incorrect
Question 6 of 10

6. Question
What is the condition for a Class 1 assembly when a top routed wire has solder 80% of the height of the bifurcated terminal post?
- Acceptable
- Process Indicator
- Defect
- Not Established
Correct

Incorrect
Question 7 of 10

7. Question
What is the condition for a Class 3 assembly when a wire is wrapped 90 degrees around a punched terminal has a solder fillet of 75% of the interface between the wire and pierced terminal?
- Acceptable
- Process Indicator
- Defect
- Not Established
Correct

Incorrect
Question 8 of 10

8. Question
What is the condition for a Class 1 assembly that does not have evidence of 100% circumferential wetting of the wire to the wall of the solder cup?
- Acceptable
- Process Indicator
- Defect
- Not Established
Correct

Incorrect
Question 9 of 10

9. Question
What is the condition for a Class 2 high voltage assembly that has no evidence of sharp edges, inclusions, or wire strands?
- Acceptable
- Process Indicator
- Defect
- Not Established
Correct

Incorrect
Question 10 of 10

10. Question
What is the condition for a Class 3 high voltage assembly that has a balled solder connection less than maximum specified height requirements?
- Acceptable
- Process Indicator
- Defect
- Not Established
Correct

Incorrect