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What is the maximum allowable limit percentage of nickel (Ni) for an assembly that uses tin lead (SnPb) solder baths?
What is the condition for a Class 1 assembly that after soldering has evidence of no-clean flux residue on an electrical mating surface?
What is the condition for a Class 3 assembly when the solder used for tinning is different than what is used in subsequent soldering processes?
True or False: It is acceptable to reflow the solder connection when performing shrink sleeving operations.
What is the condition for a Class 2 assembly when the wire wrap has 165 degrees contact between the wire and turret terminal post?
What is the condition for a Class 1 assembly when a top routed wire has solder 80% of the height of the bifurcated terminal post?
What is the condition for a Class 3 assembly when a wire is wrapped 90 degrees around a punched terminal has a solder fillet of 75% of the interface between the wire and pierced terminal?
What is the condition for a Class 1 assembly that does not have evidence of 100% circumferential wetting of the wire to the wall of the solder cup?
What is the condition for a Class 2 high voltage assembly that has no evidence of sharp edges, inclusions, or wire strands?
What is the condition for a Class 3 high voltage assembly that has a balled solder connection less than maximum specified height requirements?