620-M3-Quiz2

True or False: For a Class 3 assembly, gold is only required to be removed from surfaces of solder cup terminals that are plated 2.54 µm or greater.

What is the maximum wetting angle if the solder contour does not extend over the solderable termination area?

What is the condition for a Class 2 assembly with a hidden solder connection if process controls are not maintained to ensure repeatability of assembly techniques?

What is the condition for a Class 1 assembly when solder build-up interferes with subsequent assembly steps?

What’s the difference between wire overlap and overwrap?

What is the condition for a Class 3 assembly when a side routed wire overlaps itself on a bifurcated terminal?

What is the condition for a Class 2 assembly that has a wire placed outside the arc of the hook and 1 diameter distance away from the base of the hook terminal?

What is the condition for a Class 3 assembly that has a series connected bus bar connecting 4 bifurcated terminals without the wire touching a middle terminal’s base?

What is the condition for a Class 2 high voltage assembly that has discernible solder points?

What is the condition for a Class 1 high voltage assembly that has all sharp edges of terminals completely covered with solder forming a spherical solder ball?