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For how long shall a manufacturer of Class 2 assemblies maintain the records containing the analyses and results of solder bath usage?
What is the condition for a Class 1 assembly that underwent cleaning after soldering using an incompatible cleaning material that may adversely affect performance and reliability?
What is the condition for a Class 1 assembly if there are voids in the solder connection provided it meets all other requirements?
True or False: Tinning of stranded wires is mandatory when using heat shrinkable soldering devices.
What is the condition for a Class 2 assembly when the insulation clearance is 2.5 wire diameters and does not violate minimum electrical clearance?
What is the condition for a Class 3 assembly when the shrink sleeving is tight on both the terminal and wire?
What is the condition for a Class 3 assembly when the lead is wrapped 180 degrees around a turret terminal and has a solder fillet of 60% of the interface between the lead and terminal?
What is the condition for a Class 1 assembly when the solder fillet is not formed with 100% of the wire in contact with the slotted terminal?
What is the condition for a Class 3 high voltage assembly that has evidence of insulation indentations and ragged edges?
What is the condition for a Class 1 high voltage assembly that has an insulation clearance of 0.75 wire diameters?