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What is the condition for a Class 3 assembly with a soldered press fit pin that has solder wicking of 2.75 mm that does not interfere with pin fit attachments?
What is the condition for a Class 3 assembly with a soldered press fit pin that has a 330 degree solder fillet visible on the assembly’s protrusion side?
What is the condition for a Class 1 assembly with a press fit pin annular ring lifted 50% of the annular ring width?
What is the condition for a Class 3 assembly with a press fit pin that is twisted?
What is the condition for a Class 3 assembly when a jackpost height is above the connector face resulting in the connector not mating correctly?
What is the condition for a Class 1 assembly when a solid wire is wrapped clockwise around a screw head for 270 degrees?
What is the condition for a Class 2 assembly with threaded hardware improperly installed such that it is not seated?
What is the condition for a Class 3 assembly with a heatsink that is loose?
What is the condition for a Class 2 assembly with high power components that have sharp edges of the washer against an insulator?
What is the condition for a Class 2 assembly that has hardware mounted such that it reduces the spacing below minimum electrical clearance?