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What is the condition for a Class 3 assembly that has been staked after soldering and the staking adhesive is visible on lands and conductive traces but does not interfere with any solder connection?
What is the condition for a Class 1 assembly that has a surface mount component with lead deformed 10% of its lead diameter and not exposing base metal?
True or False: Solder should not extend under components whose leads are made of Alloy 42 metals.
What is the condition for a Class 2 assembly that has a cylindrical end cap termination surface mount component with 25% end overlap?
What is the condition for a Class 1 assembly that has a castellated termination surface mount component with side joint length less than the castellation depth and wetting evident?
What is the condition for a Class 2 assembly that has a flat gull wing lead termination surface mount component with toe overhang of 10% and the foot length is twice the lead width?
What is the condition for a Class 2 assembly that has a butt mounting component using modified through-hole termination with fillet height of 0.75mm and solder touching the packaging body?
What is the condition for a Class 1 assembly that has an inward formed L-shaped ribbon lead component and a toe overhang that does not violate minimum electrical clearance?
What is the condition for a Class 3 assembly that has a flattened post termination component on a round solder land and termination overhang of 25% termination width?
True or False: It is acceptable to have absent solder balls when the design specifies it.