610-M6-Quiz 2
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Question 1 of 10
1. Question
What is the condition for a Class 2 assembly that has a flattened post termination component on a square solder land and termination overhang of 25% termination width?
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Question 2 of 10
2. Question
True or False: Thermal plane voids are not allowable for bottom thermal plane termination (D-Pak) components.
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Question 3 of 10
3. Question
What is the condition for a Class 3 assembly that has bottom termination component and end joint width of 50% termination width?
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Question 4 of 10
4. Question
What is the condition for a Class 1 assembly that has a ball grid array component with collapsing balls and 25% voiding of a ball within the x-ray image area?
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Question 5 of 10
5. Question
What is the condition for a Class 2 assembly that has an inward formed L-shaped ribbon lead component and a side overhang of 25% lead width?
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Question 6 of 10
6. Question
What is the condition for a Class 3 assembly that has a tall profile component with bottom only terminations and a side overhang of 25% termination width?
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Question 7 of 10
7. Question
What is the condition for a Class 2 assembly that has a butt mounting component using solder charged terminations with toe overhang of 5%?
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Question 8 of 10
8. Question
What is the condition for a Class 1 assembly that has a butt mounting component using modified through-hole termination with side overhang of 15%?
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Question 9 of 10
9. Question
What is the condition for a Class 3 assembly that has a round gull wing lead termination surface mount component with end joint width of 70% lead diameter?
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Question 10 of 10
10. Question
What is the condition for a Class 2 assembly that has a surface mount component with lead flattened (coined) to 50% of its original diameter?
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