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What is the condition for a Class 3 assembly that has a component with fractured solder bead?
What is the condition for a Class 1 assembly that has a lead with split sleeving?
What is the condition for a Class 2 assembly that has a vertical radial leaded component in a supported hole with an improperly formed lead?
What is the condition for a Class 3 assembly that has a horizontally mounted axial leaded component not required to be mounted above the board surface and supported holes, but is 1.0mm between the component body and board surface?
What is the condition for a Class 3 assembly that has a supported hole with tempered lead fully clinched?
What is the condition for a Class 2 assembly that has a component with meniscus in a supported hole but the meniscus is not embedded in the solder joint?
True or False: Class 3 criteria for mounting boards perpendicular to others in supported holes (board in board) have not been established.
What is the condition for a Class 2 assembly that has an axially leaded component in an unsupported hole mounted horizontally off the board 1.0mm?
What is the condition for a Class 3 assembly that has a leaded component in an unsupported hole clinched 45 degrees and not toward a noncommon conductor?
What is the minimum inside bend radius for a 1.0mm lead thickness?