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What is the condition for a Class 3 assembly that has a leaded component in an unsupported hole soldered with circumferential wetting of 330 degrees on an unclinched lead?
True or False: For unsupported holes, partially clinched leads are considered as fully clenched for part retention and should meet protrusion requirements.
What is the condition for a Class 2 assembly that has a daughterboard mounted to a motherboard (board in board) in supported holes such that the motherboard’s land area has wetted solder coverage of 10% on the primary side (solder destination side)?
What magnification is required for inspecting Class 2 and Class 3 solder terminations in supported holes that undergo lead cutting after soldering?
What is the condition for a Class 1 assembly that has a supported hole with the solder destination land area not being wetted with solder?
What is the condition for a Class 3 assembly that has a supported hole that is soldered such that the lead is not discernible due to excess solder?
What is the condition for a Class 1 assembly that has a vertically mounted axial leaded component mounted in a supported hole with component height exceeding the design dimensions?
What is the condition for a Class 1 assembly that has an elevated component with adhesive staking covering 50% of the component’s width and 75% of the component’s height?
True or False: Visual inspection of adhesive bonding (staking) may be performed without magnification, and referee may be performed at 3X – 5X.
What is the condition for a Class 1 assembly that has a connector with misalignment, but still is able to mate correctly and meets lead protrusion and height requirements?