610-M5-Quiz 1

610-M5-Quiz 1

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Question 1 of 10

1. Question
What is the condition for a Class 2 assembly that has a horizontally oriented component mounted backwards in the wrong hole?
- Acceptable
- Process Indicator
- Defect
- Not Established
Correct

Incorrect
Question 2 of 10

2. Question
What is the condition for a Class 2 assembly that has a component with lead formed 0.75mm away from the component body?
- Acceptable
- Process Indicator
- Defect
- Not Established
Correct

Incorrect
Question 3 of 10

3. Question
What is the condition for a Class 3 assembly that has a component lead entering the through hole perpendicular to the board surface?
- Acceptable
- Process Indicator
- Defect
- Not Established
Correct

Incorrect
Question 4 of 10

4. Question
What is the condition for a Class 1 assembly that has a Dual-In-Line Package (DIP) that is tilted but still meets lead protrusion and height requirements?
- Acceptable
- Process Indicator
- Defect
- Not Established
Correct

Incorrect
Question 5 of 10

5. Question
True or False: Connector module misalignment is measured at the connector lead-in area or at the pin tip.
- True
- False
Correct

Incorrect
Question 6 of 10

6. Question
What is the condition for a Class 3 assembly that has a metallic mounting clip uninsulated from the underlying circuitry?
- Acceptable
- Process Indicator
- Defect
- Not Established
Correct

Incorrect
Question 7 of 10

7. Question
What is the condition for a Class 1 assembly that has a conductive securing device holding the component firmly against the surface and not violating minimum electrical clearance?
- Acceptable
- Process Indicator
- Defect
- Not Established
Correct

Incorrect
Question 8 of 10

8. Question
What is the condition for a Class 2 assembly that has a lead protrusion from a supported hole of 2.0mm and does not violate minimum electrical clearance?
- Acceptable
- Process Indicator
- Defect
- Not Established
Correct

Incorrect
Question 9 of 10

9. Question
What is the condition for a Class 2 assembly that has a supported hole with 1.0mm vertical solder fill for each lead of a 14-lead component and circumferential wetting of 180 degrees on solder destination side and circumferential wetting of 270 degrees on the solder source side?
- Acceptable
- Process Indicator
- Defect
- Not Established
Correct

Incorrect
Question 10 of 10

10. Question
What is the condition for a Class 1 assembly that has a component in a supported hole with solder on the lead bend and on the component body?
- Acceptable
- Process Indicator
- Defect
- Not Established
Correct

Incorrect