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What is the condition for a Class 1 assembly that has conformal coating on a connector mating surface?
What is the condition for a Class 2 assembly that has solder mask flaking which exposes the base conductor material?
How many attempts can be made to read machine readable code on a marking label before it is considered a defect?
What is the condition for a Class 2 assembly that has an etched legend irregularly formed, but is still discernible?
What is the condition for a Class 1 flexible printed board assembly that has delamination less than 1% of the area and does not reduce minimum conductor spacing?
What is the condition for a Class 3 assembly that has a reduction in land width of 25%?
What is the maximum recommended bow and twist deflections allowed for surface mount technology applications?
What is the condition for a Class 3 assembly with a distance of 0.1mm from haloing penetration to nearest conductive feature when the minimum lateral conductor spacing is not specified?
What is the condition called when there is localized swelling and separation between the base material and conductive foil?
What is the condition for a Class 2 assembly that has a backplane connector pin with a burr?