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What is the condition for a Class 1 assembly that has a connector with pins bent off center by 15% pin diameter?
What is the condition for a Class 3 assembly for a leaded device that has cracks in the shield material?
What is the condition for a Class 3 assembly when a chip resistor is damaged, but there is no exposure of its resistive element?
What is the condition for a Class 3 assembly for a leadless device that has damaged component insulation exposing its conductive surface, but there is no risk of shorting to adjacent components?
What is the condition for a Class 2 assembly that has a connector with cracks in noncritical areas, but they do not impact structural integrity?
What is the condition for a Class 2 assembly that has a relay with scratches and cuts that penetrate the case?
What is the condition for a Class 1 assembly that has a backplane connector pin with missing plating on a required area?
What is the condition for a Class 3 assembly that has measling?
What is the condition for a Class 1 assembly with rough, but not frayed board edges?
What is the condition for a Class 2 flexible printed board assembly that has 4 separations within a 25 mm x 25 mm area, with each separation being less than 0.8 mm x 0.8 mm in area?