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What is the condition of a Class 2 assembly when a 3-sided termination has lost 40% of its top metallization?
What is the condition for a Class 2 assembly for a leaded device that has component damage, but the required identification is not removed?
What is the condition for a Class 1 assembly for a ceramic chip capacitor that has an exposed electrode?
What is the condition for a Class 3 assembly that has a relay with minor imperfections not affecting the seal?
What is the condition for a Class 3 assembly that has cracks in a mounted connector connecting the mounting hole to an edge?
What is the condition for a Class 1 assembly that has a heatsink that is bent?
What is the condition for a Class 1 assembly that has crazing, but is functional?
What is the condition called when the laminate glass cloth weave pattern is visible and not completely covered with resin?
What is the maximum recommended bow and twist deflections allowed for through hole technology applications?
What is the condition for a Class 3 assembly that has a separated trace from the laminate surface?