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What is the condition for a Class 3 high voltage assembly that has a balled solder connection less than maximum specified height requirements?
What is the condition for a Class 2 assembly if the heat shrinkable soldering device solder preform is centered over the connection but not fully melted?
What options are available to assess a non-visible solder joint? (select all that apply)
What criteria has to occur in order for a Class 2 assembly with a hot tear to be acceptable?
What is the condition for a Class 1 assembly if a solder joint is fractured?
Soldering criteria is applicable for which methods? (select all that apply)
What is the condition for a Class 2 assembly that has encapsulated solder balls that do violate minimum electrical clearance?
What is the condition for a Class 2 assembly if a solder projection violates assembly height requirements?
What is the condition for a Class 2 high voltage assembly that has no evidence of sharp edges, inclusions, or wire strands?
What is the condition for a Class 2 high voltage assembly that has evidence of some reflow lines?