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What is the condition for a Class 1 assembly if there are voids in the solder connection provided it meets all other requirements?
What is the condition for a Class 3 assembly if solder paste is not completely reflowed?
What helps identify when to stop heating a heat shrinkable soldering device?
What is the condition for a Class 1 high voltage assembly that has a terminal lug void of solder?
Acceptable high voltage criteria as specified in IPC-A-610 prevents what from occurring?
What is the condition for a Class 3 high voltage assembly that has evidence of edges with nicks and crevices?
What is the condition for a Class 1 assembly if the heat shrinkable soldering device sleeve is discolored (not charred)?
What is the condition for a Class 3 assembly if a solder projection violates minimum electrical clearance?
True or False: An acceptable solder connection only requires evidence of adherence of solder to the soldered surface.
What is the condition for a Class 3 assembly that has a solder splash impacting form, fit, or function?