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What is the condition for a Class 1 high voltage assembly that has an insulation clearance of 0.75 wire diameters?
What is the condition for a Class 3 high voltage assembly that has evidence of indentations and ragged edges?
What is the condition for a Class 2 assembly if there are blow holes that reduce the connection below minimum requirements?
When is it acceptable for a Class 3 assembly to have exposed basis metal? (select all that apply)
What is the condition that is caused by movement of the solder joint during cooling?
What is the condition if a partially visible solder joint is not visually inspected on the visible portion?
What is the condition for a Class 3 assembly if a solder joint is cracked?
What defines the inability of molten solder to form a metallic bond with the base metal?
What is the condition for a Class 1 assembly that has solder bridging between noncommon conductors?
What is the condition for a Class 2 assembly if there is exposed basis metal on a land due to scratches provided the requirements of sections 7.1.2.4 and 8.2.2 are met?