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Who has the responsibility to define the class of an assembly?
How many process indicators can be identified before they need to be dispositioned?
What side of the board is the solder destination side when using through-hole technology?
What maximum referee would you use for a 0.041 in. land diameter?
Which joint industry document contains requirements for handling moisture sensitive devices (MSDs)?
What type of packaging prevents electrostatic discharge (ESD) from passing through it?
What inspection range would you use for a 12 AWG wire?
Does a relative humidity (RH) of 10-20% cause more, less, or the same electrostatic voltage generation than a RH of 65-90%?
If 99% of components are properly integrated onto a circuit card assembly but the other 1% of components are missing, the assembly is deemed what?
What related document is used to assess the acceptability of rigid printed boards?