Module 4: Metal Core Printed Boards (Section 4.2) thru Flushness of Surface Conductor (Section 4.3.1)
Module 3: Plated Through Holes – General (Section 3.3) thru Solder Coating Thickness (Only When Specified) (Section 3.3.25)
Module 3: Internally Observable Characteristics (Section 3) thru Hole Wall Dielectric/Plated Barrel Separation (Hole Wall Pullaway) (Section 3.1.9)